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Design-for-test or built-in self-test may be vitally necessary to achieve MTTR goals. Change, and an urge for novelty, are key aspects of human existence, but sometimes these urges must be resisted. This ability to resist the urge to make changes unless it is absolutely necessary to do so is cited as a major reason for Intel’s success. 35 An investigation revealed that a processing change caused wafers to move more quickly from one station to the next. As a result, the temperature of the wafers as they arrived at the next station deviated from what it had previously been, and the deviation was enough to adversely affect the yield of the die on those wafers.

Point B on the graph corresponds to a point where process yield is lower than the required quality level. However, testing will identify enough defective units to bring quality back to the required quality level. The horizontal distance from point A to point B on the graph is an indication of the extent to which the process capability can be made more aggressive, while meeting quality goals. The object is to move as far to the right as possible, while remaining competitive. At some point the cost of test will be so great, and the yield of good die so low, that it is not economically feasible to operate to the right of that point on the solid line.

Of the 72,912 die initially considered, 847 chips that failed parametric test and 7699 chips that failed continuity test were removed from consideration. Of the remaining 64,366 chips, 18,476 failed the functional test. 30%. 92%. 2. In most columns the spread between these formulas varies by as much as a factor of two. The one exception is the last column, where the SPR and JSSC models differ by an order of magnitude. The bottom row of the table lists the actual fraction of defects detected at various stages of testing the chips.

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